Design layout of Rigid, Flex, Rigid Flex
and Back plane boards
2 to 36 layer thru-hole, multi-layer,
double sided surface mount mixed
technology
Digital, Analog, RF
High current low voltage, Low voltage
high current boards
High Speed Controlled Impedance,
Differential Pairs, Matched Lengths,
Blind/ Buried via’s
Via in pad with Sequential Lamination
.4mm and .5mm pitch BGA’s